
Company: Chipbond Technology Corporation
Bloomberg ticker: 6147 TT
Market cap: US$5,131m
Background: Chipbond Technology Corporation provides downstream packaging and testing services for the semiconductor industry. Operating primarily in Taiwan and Malaysia, the company is globally recognized for its display driver IC solutions, gold bumping services, and advanced chip-on-film packaging.
World Class Benchmarking of Chipbond Technology

Profitable Growth rank of 7 was same compared to the prior period’s 7th rank
This is below average performance compared to 640 large Info Tech companies worldwide
Profitability rank of 6 was better than its Growth rank of 9
Profitability rank of 6 was the same compared to the prior period’s 6th rank
This is below average performance compared to peers
Growth rank of 9 was the same compared to the prior period’s 9th rank
This is poor performance compared to peers




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